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W55RFS27R3C
Super-Regeneration RF Receiver W55RFS27R3C Data Sheet
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Publication Release Date: May 31, 2005 Revision A1
W55RFS27R3C
Table of Content1. GENERAL DESCRIPTION ......................................................................................................... 3 1.1 1.2 W55RFS27R3C Features............................................................................................... 3 W55RFS27R3C Pad Definition....................................................................................... 4
1.2.1 1.2.2 W55RFS27R3C Pad Description..................................................................................4 Power-On Trapping Function Description.....................................................................5
2.
SYSTEM DESCRIPTION............................................................................................................ 6 2.1 2.2 W55RFS27R3C System Block Diagram ........................................................................ 6 W55RFS27R3C Functional Description ......................................................................... 7 W55RFS27R3C Absolute Maximum Ratings ................................................................. 8 W55RFS27R3C DC Characteristics ............................................................................... 8 W55RFS27R3C Ordering Information ............................................................................ 9 W55RFS27R3C Package Information ............................................................................ 9
3.4.1 3.4.2 W55RFS27R3C Bonding Pad List................................................................................9 W55RFS27R3C Bonding Pad Diagram ......................................................................10
3.
ELECTRONIC CHARACTERISTICS.......................................................................................... 8 3.1 3.2 3.3 3.4
4.
DESIGN INFORMATION .......................................................................................................... 11 4.1 W55RFS27R3C Reference Design .............................................................................. 11
4.1.1 W55RFS27R3C Application Circuit ............................................................................11
5.
REVISION HISTORY ................................................................................................................ 13
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W55RFS27R3C
1. GENERAL DESCRIPTION
The Winbond W55RFS27R3C is a fully integrated, S-R (Super-regeneration) RF receiver with fullfunction baseband command decoder for R/C vehicles, toys, or wireless data communication applications. The W55RFS27R3C provides two input modes: uC-mode, for general-purpose, micro-controller interfaces to the RF transmitter (the decoder is disabled); and manual-mode, for a 6-function, baseband command decoder and RF receiver. Manual-mode is also designed with the Winbondpatented ChannelSharedWB protocol for multi-player applications, and up to three players are allowed simultaneously in the same frequency band. As a result, the W55RFS27T3B / W55RFS27R3C provide a simple remote control capability for multiple players with low cost and high performance. In addition, the W55RFS27R3C accommodates a wide range of operating voltages (2.2 ~ 5.5 V) and supports 2- or 3-battery applications. The associated transmitter W55RFS27T3B meets FCC/ETSI regulations for 27 MHz, 40 MHz, and 49 MHz S-R (Super-regeneration) demodulation.
1.1 W55RFS27R3C Features
Winbond patented ChannelSharedWB simultaneously in one frequency band. protocol enables a maximum of three players
On-chip LNA provides better isolation so that receivers can work together without interference. Enhanced receiver circuit provides higher sensitivity than traditional super-regenerative circuits. Operating frequencies: 27 MHz to 49 MHz (depending on the oscillator frequency) Operating voltages: 2.2 V ~ 5.5 V (uC-mode) Receiving data rates up to 2.5 Kbps for 50% duty cycle signals (manual-mode) R/C-toy baseband control command decoder, supporting 6 functions; Forward, Backward, Left-turn, Right-turn, and 2 user-defined functions F1 and F2 (manual-mode) Frequency hopping increases receiver sensitivity Power-down current consumption less than 1 A Associated transmitter W55RFS27T3B is compliant with FCC part 15 Subpart C 15.227 / ETSI 300 220-1 low-power and short-range device requirements Operating temperature: 0C ~ 70C
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Publication Release Date: May 31, 2005 Revision A1
W55RFS27R3C
1.2 W55RFS27R3C Pad Definition
1.2.1 W55RFS27R3C Pad Description
PAD NO. I/O A/D FUNCTIONAL DESCRIPTION
SYMBOL
GND CMFB RBIAS RSAW VDDA VDDA GND_LNA VDD_LNA SDINGD LNAING LNAINS LNAOUT OSCin OSCout GNDA Resetn Mode ID0 ID1 TEST F1
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21
Ground I/O I/O I/O Power Power Ground Power Ground I I O O O O I/O I I I I I/O
A A A A A A A A A A A A A A A D D D D D D
Ground return path Common-mode feedback capacitor connection Resistor to adjust internal ring-oscillator frequency Resistor to control internal saw generator Regulated voltage output Regulated voltage output LNA Ground return path LNA power input Filter capacitor connection LNA Gate input LNA Source input LNA output(NC) Oscillator tank input Oscillator tank output Regulator ground return path Resetn =0 reset whole circuit, internal pull-high Receiver mode selection; should be "0" for regular operation ID setting(LSB) for Channel shared protocol ([ID1:ID0] = [1,1]) uC-mode ID setting (MSB) for Channel shared protocol ([ID1:ID0] = [1,1]) uC-mode TEST=1, reserved for chip testing, internal pull-low (manual-mode) Decoder F1 output (uC-mode) Set to "0". (manual-mode) Decoder F2 output (manual-mode) Power on trapping of Frequency Hopping (uC-mode) $ENB ("0" to power down)
F2
22
I/O
D
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W55RFS27R3C
W55RFS27R3C Pad Description, continued.
SYMBOL
PAD NO.
I/O
A/D
FUNCTIONAL DESCRIPTION
(manual-mode) Decoder Right-turn output R 23 I/O D (uC-mode) HOP_CLK (toggle every 20 ms for better performance or fix at "0" or "1") (manual-mode) Decoder Left-turn output (uC-mode) Set to "0". (manual-mode) Decoder Backward output (uC-mode) Set to "1". (manual-mode) Decoder Forward output (uC-mode) Set to "0". Receiver data output / Power on trapping of LNA Power input
L B F RXD VSPLY
24 25 26 27 28
I/O I/O I/O I/O Power
D D D D A
1.2.2
Power-On Trapping Function Description
TRAPPING STATE FUNCTION DESCRIPTION RECOMMENDED USAGE
POWERTRAPPING PIN NAME
1 RXD 0 1 F1* 0 1 F2 0
Enable LNA Disable LNA Not Used Not Used Enable Frequency Hopping Disable Frequency Hopping Enable Frequency Hopping Disable (Set to "0") Enable LNA
* Note: Currently, F1 does not support any functions, but it should be set to "0" when the W55RFS27R3C is powered on.
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Publication Release Date: May 31, 2005 Revision A1
W55RFS27R3C
2. SYSTEM DESCRIPTION
2.1 W55RFS27R3C System Block Diagram
LNA. Rectifier Filter
OSCin OSCout Oscillator
Power Regulator
Data Slicer RXD
Saw Generator
Qch osc
MODE0 Power-On Reset Baseband Decoder IDx
RSAW
RBIAS
RESETn
F
B
L
R
F1
F2
This block diagram is applicable in manual-mode. There are some differences in uC-mode.
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W55RFS27R3C
2.2 W55RFS27R3C Functional Description
ChannelSharedWB Protocol Engine
The W55RFS27R3C / W55RFS27T3B built-in ChannelSharedWB protocol allows a maximum of three players simultaneously in the same frequency band. Each player is distinguished by the input states of ID1 and ID0, instead of different frequencies. This approach significantly reduces the cost and complexity of multi-player applications.
Frequency Hopping and HOP_CLK
In manual-mode, the W55RFS27R3C can automatically toggle the center frequency very slightly to increase the receiver sensitivity. The W55RFS27R3C stops toggling while data is being received and resumes again afterwards. This is called frequency hopping, and it is available in manual-mode. Frequency hopping is enabled and disabled by the F2 pin, whose value is trapped during power-on. In uC-mode, toggling is controlled manually using HOP_CLK (R pin, pin 23), and it is effectively disabled by fixing the value of HOP_CLK at either "0" or "1".
RF Receiver
The W55RFS27R3C has been implemented using an enhanced "Super-Regenerative" receiving architecture. The resulting high sensitivity and high noise immunity is suitable for getting higher RF receiving performance in very noisy environments. In addition, the on-chip LNA provides isolation from other receivers, which is important in multi-player applications.
Power Regulator
The W55RFS27R3C built-in power regulator provides stable operating performance for operating voltages from 2.2 to 5.5 V, a very wide range of voltages suitable for 2- or 3-battery R/C toys or R/C vehicles.
Baseband Control Function Decoder
The W55RFS27R3C has a built-in, 6-function baseband control function decoder for R/C toys. The six functions include Forward; Backward; Left-turn; Right-turn, and two user-defined functions F1 and F2.
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Publication Release Date: May 31, 2005 Revision A1
W55RFS27R3C
3. ELECTRONIC CHARACTERISTICS
3.1 W55RFS27R3C Absolute Maximum Ratings
PARAMETER RATING UNIT
Supply Voltage to Ground Potential Applied Input/Output Voltage Power Dissipation (Ta = 70C) Ambient Operating Temperature Storage Temperature
- 0.3 to 6.5 - 0.3 to 6.5 150 0 to 70 -40 to 85
V V mW C C
Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of the device.
3.2 W55RFS27R3C DC Characteristics
(VDD-VSS = 3 V, Ta = 25C; unless otherwise specified)
PARAMETER
SYM.
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Power Supply Operating Voltage Operating Current Stand-by Current Digital Input/Output Pin Input High Voltage Input Low Voltage F,B,L,R,F1,F2 Output High Source Current F,B,L,R,F1,F2 Output Low Sink Current RXD Output High Source Current RXD Output Current Oscillator Operation Frequency Quench frequency Baseband Decoder Section Modulation Duty Cycle Received Data Rate MDYT RDTT 50% Duty-cycle Manchester Code 30 50 2.5 70 % Kbps FOSC FQCH 27 170 200 49.8 250 MHz KHz Low Sink VIH VIL IOH IOL IOH IOL VOH=0.7 * VDD VOL=0.3 * VDD VOH=0.7 * VDD VOL=0.3 * VDD 0.8*VDD VSS 6 6 2 2 VDD 0.1*VDD V V mA mA mA mA VDD IOP ISBY VDD=5.5V VDD=5.5V , ENB= 0 (uC-mode) 2.2 5.5 4 2 V mA A
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W55RFS27R3C
3.3 W55RFS27R3C Ordering Information
The W55RFS27R3C is available in two types of packages: Dice form and Wafer form.
PART NUMBER PACKAGE REMARKS
W55RFS27R3C(H) W55RFS27R3C(W)
Dice form Wafer form
3.4 W55RFS27R3C Package Information
3.4.1 W55RFS27R3C Bonding Pad List
Window : (xl = -1228.000, yl = -625.000),(xh = 1228.000, yh = 625.000) Windows size : Width = 2456.000, length = 1250.000 =========================================================================== PAD NO 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 PAD NAME * GND CMFB RBIAS RSAW VDDA: VDDA: GND_LNA VDD_LNA SDINGD LNAING LNAINS LNAOUT OSCin OSCout GNDA resetn MODE ID0 ID1 TEST F1 PIN NO(DIP28) *1 2 3 4 5 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 X -33.015 -385.965 -492.965 -599.965 -709.365 -821.165 -1143.000 -1143.000 -1143.000 -1143.000 -1143.000 -1143.000 -815.090 -685.215 -575.165 -148.690 -41.690 65.310 172.310 279.310 389.910 Y 540.000 540.000 540.000 540.000 540.000 540.000 532.375 420.975 308.495 174.685 -46.460 -525.320 -540.000 -540.000 -540.000 -540.000 -540.000 -540.000 -540.000 -540.000 -540.000 ---------------------------------------------------------------------------
------------------------------21(GND) -------------------------------------
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Publication Release Date: May 31, 2005 Revision A1
W55RFS27R3C
22 23 24 25 26 27 28 F2 R L B F RXD VSPLY 22 23 24 25 26 27 28 770.310 655.860 541.410 426.960 312.510 196.535 78.385 540.000 540.000 540.000 540.000 540.000 540.000 540.000
(*: Bonding Sequence start from GND (Pin1))
3.4.2
W55RFS27R3C Bonding Pad Diagram
12 21 20 19 18 17 16 15 14 13
11
W55RFS27R3C
10 22 23 24 25 26 27 28 *1 2 3 4 5 6 9 8 7
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W55RFS27R3C
4. DESIGN INFORMATION
4.1 W55RFS27R3C Reference Design
4.1.1 W55RFS27R3C Application Circuit
1 2 3 4 5 6 VSPLY C1 + C2 10uF C4 15nF R5 -BAT+ CON2 10uF C25 47nF F3 CON3 VSPLY RXD CON1 RXD3 CON3 VSPLY R8 10k R4 F 330 R6 B 330 R9 L 330 1 3 2 1 D
D
R3 C10 + 10uF C9 15nF
1 2
3 2 1
3 2 1
C
1uF 1
ANT1 SMA
C11 15nf C24 15nf
oL2 1.2uH
GND1 CMFB 2 RBIAS 3 RSAW 4 VDDA 5 6 LNA_GND LNA_VDD 7 SDINGD 8 LNAING 9 LNAINS 10 11 LNAOUT OSCin12 OSCout 13 14 GNDA
3 2 1
ANT ANTENNA
+
3 2 1
W55RFS27R3C B oL0 2 2 1 1.5uH 1 2 1 VSPLY resetn BUTTOM 4 3 C13 20pF C12 27pF 3 2 1 VSPLY 3 2 1 VSPLY 3 2 1 3 2 1 VSPLY R15 F110k
3 2 1
MODE CON3
ID0 CON3
ID1 CON3
TEST CON3
Power Pin: VSPLY GND
A
Input Pin: ID0 ID1- - switch VSPLY or GND MODE - - switch VSPLY or GND TEST - - Jump switch VSPLY or GND
Output/Input Pin: F B L R - - Jump switch VSPLY or GND Output/Power on trapping: RXD F1 F2 CPU mode Power down: F2 Test Pin : RXD RF Pin: ANT
3 4 Title Size B Date: File: 8-Jul-2004 C:\temp\BACKUP~22.DDB 5 Sheet of Drawn By: 6
3 2 1
1
2
+
R2 0 VSPLY
F 1 LED B 1 LED L 1 LED 1 LED F2 1 LED 1 LED F23 CON3 VSPLY 2 2 2 C 2 2 2
F
B3 CON3 C3 68nF B VSPLY
L3 CON3 VSPLY
R10 R R 330 R11 F2 330 R12 F1 F1330
C8 U1 GND VSPLY CMFB RXD RBIAS F RSAW B VDDA L GND_LNA R VDD_LNA F2 SDINGD NA LNA_ING F1 LNA_INS TEST LNAOUT ID1 OSCin ID0 OSCout MODE GNDA resetn 28 27 26 25 24 23 22 21 20 19 18 17 16 15 VSPLY RXD F B L R F2 F1 TEST ID1 ID0 MODE resetn L R-3 CON3
R
VSPLY
R14 F2 10k
F13 CON3 VSPLY B
W55RFS27R3C APPLICATION CIRCUIT
Number Revision
A
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Publication Release Date: May 31, 2005 Revision A1
W55RFS27R3C
W55RFS27R3C Application Schematic BOM: Item 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. Qty 1 1 1 1 2 1 3 4 1 1 1 1 5 1 1 1 Reference 0 1.2uH 1.5uH 1uF 10k 10k 10uF 15nF 20pF 27pF 47nF 68nF 330 330 ANTENNA W55RFS27R3C Part R2 oL2 oL0 C8 R8 R14 R15 C1 C2 C10 C4 C9 C11 C24 C13 C12 C25 C3 R4 R6 R9 10 R11 R12 ANT U1 --------------------------------------------------------------------------------------------------------------------------
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W55RFS27R3C
5. REVISION HISTORY
VERSION DATE PAGE DESCRIPTION
A0 A1
2004/7/8 2005/5/31
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Preliminary version A0 Released version A1(Revised by Brand) and Important Notice
Important Notice
Winbond products are not designed, intended, authorized or warranted for use as components in systems or equipment intended for surgical implantation, atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for other applications intended to support or sustain life. Further more, Winbond products are not intended for applications wherein failure of Winbond products could result or lead to a situation wherein personal injury, death or severe property or environmental damage could occur. Winbond customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Winbond for any damages resulting from such improper use or sales.
Headquarters
No. 4, Creation Rd. III, Science-Based Industrial Park, Hsinchu, Taiwan TEL: 886-3-5770066 FAX: 886-3-5665577 http://www.winbond.com.tw/
Winbond Electronics Corporation America
2727 North First Street, San Jose, CA 95134, U.S.A. TEL: 1-408-9436666 FAX: 1-408-5441798
Winbond Electronics (Shanghai) Ltd.
27F, 2299 Yan An W. Rd. Shanghai, 200336 China TEL: 86-21-62365999 FAX: 86-21-62365998
Taipei Office
9F, No.480, Rueiguang Rd., Neihu District, Taipei, 114, Taiwan, R.O.C. TEL: 886-2-8177-7168 FAX: 886-2-8751-3579
Winbond Electronics Corporation Japan
7F Daini-ueno BLDG, 3-7-18 Shinyokohama Kohoku-ku, Yokohama, 222-0033 TEL: 81-45-4781881 FAX: 81-45-4781800
Winbond Electronics (H.K.) Ltd.
Unit 9-15, 22F, Millennium City, No. 378 Kwun Tong Rd., Kowloon, Hong Kong TEL: 852-27513100 FAX: 852-27552064
Please note that all data and specifications are subject to change without notice. All the trade marks of products and companies mentioned in this data sheet belong to their respective owners.
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Publication Release Date: May 31, 2005 Revision A1

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